Sensing packaging solution
Suitable for biometric recognition devices and medical equipment! Components inside the package can be SMD mounted!
We handle the "Sensing Packaging Solutions" manufactured by Harbatech. The company has the technology to integrate multiple components into a single package, starting with the development and manufacturing of LEDs, and has a proven track record in custom development of sensors and more over many years. This product allows for the addition of other functions or enhancement of performance to existing sensors. The wafers that can be handled are up to 8 inches, and bonding pads can be accommodated down to a minimum of 50μm. 【Features】 ■ Oblique W/B (Wire Bonding) is possible ■ Components can be mounted under W/B due to oblique W/B ■ Gold wire up to Φ5mm can be used ■ Components within the package can be SMD mounted * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
- Company：グローバル電子
- Price：Other
